3M™ Diamond Pad Conditioners for CMP
In stock
Reconfirm the price with seller
- Customer pickup,
- Courier
- In detail
Products of other enterprises
Technical characteristics
- BrandDiamond
Description
Highly engineered structured abrasive products deliver reliable performance for critical semiconductor CMP applications. 3M™ Diamond Pad Conditioners use deliberate diamond placement and protusion to produce a consistent finish, with superior diamond retention to reduce scratching.
Key features and benefits:- Lower cost of ownership
- Optimized for extended pad and disk life
- Flat area of active diamonds for low non-uniformity
- Exclusive polymer substrate enhances corrosion resistance
- Diamonds secured with both chemical and mechanical bonds for superior retention
Contact the seller
3M™ Diamond Pad Conditioners for CMP
We recommend to see